Polyelectrolyte nanolayers as diffusion barriers for Cu metallization

Abstract

Cu interconnect technology was studied using the interfacial layers to inhibit Cu transport into adjacent dielectric layers. Thick polyelectrolyte nanolayers were used for the study. The study showed that polyelectrolyte nanolayers were significant for applications like isolating nanoscale components in future device systems and for tailoring barrierless low-k polymeric dielectrics.