Journal article
Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits
G Ramanath, G Cui, PG Ganesan, X Guo, AV Ellis, M Stukowski, K Vijayamohanan, P Doppelt, M Lane
Applied Physics Letters | AMER INST PHYSICS | Published : 2003
DOI: 10.1063/1.1591232
Abstract
Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits were investigated. Self-assembled monolayers (SAMs) ∼0.7 nm-thick enhanced adhesion and inhibited Cu diffusion at Cu/SiO2 structures. Cu/SAM/SiO2/Si(001) structures showed three times higher interface debond energy compared to Cu/SiO2 interfaces.