Near-zero-thickness self-assembled molecular layers for future device structures: Interfacial adhesion and diffusion barrier properties

Abstract

The article discusses near-zero-thickness (NZT) self-assembled molecular layers for future device structures. The interfacial adhesion and diffusion barrier properties are also discussed. Diffusion barriers obtained through self-assembled molecular layers are attractive for Cu-based microelectronic devices because of their NZT and facile processing.