Validation of an Open-Sourced Strain Analysis Code to Assess Fragility in 3D-Printed Porous Structures Designed for Low-Rigidity Medical Implants
Wen-Ming Chen, Peter Vee-Sin Lee, Q Li (ed.), L Wang (ed.), M Zhou (ed.), L Sun (ed.), S Qiu (ed.), H Liu (ed.)
2017 10th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI) | IEEE | Published : 2017
Awarded by Shanghai PuJiang Program
Awarded by Shanghai Engineering Research Center of Assistive Devices
The current work is supported by Shanghai PuJiang Program (17PJ1407100) and the Shanghai Engineering Research Center of Assistive Devices (16441905202). The authors would like to thank Dr. Gabriele Imbalzano from Mechanical Engineering Department, University of Melbourne for his efforts in evaluating the DIC code; Thanks to Dr. Jianhu Shen and Dr. Shanqing Xu from the Centre for Innovative Structures and Materials, RMIT University, for their assistance in preparing the samples used in this study.