Conference Proceedings

Cooling of Miniature Electronic Systems Using Diamond Circuit Boards

NV Apollo, A Ahnood, H Zhan, K Ganesan, AJR Smith, S Prawer, DJ Garrett

PROCEEDINGS OF THE 17TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2018) | IEEE | Published : 2018

Abstract

The drive for miniaturization of electronic systems has led to increases in spatial power density of electronic devices, making thermal management a critical challenge. For applications which require placing electronic components into increasingly smaller areas, such as 3D IC system-in-package architectures, greater thermal loads increase the probability of device failure. In this work, we present a circuit board consisting of polycrystalline diamond which has excellent thermal conductivity and electrical resistivity. Moreover, water cooling channels are integrated into the circuit board to achieve rapid and spatially-uniform cooling compared with an alumina ceramic circuit board. The total ..

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