Modeling the Mechanical Integrity of Generic Solid Oxide Cell Stack Designs Exposed to Long-term Operation

Abstract

Thermal cycling and creep in metallic interconnects during operation of solid oxide cell (SOC) stacks could cause contact losses in the interface between the interconnect and cells. The magnitude of stress and its distribution within the SOC stack depends on the overall design of the stack and the operating conditions. In this study, stresses in different types of generic SOC stack designs caused by external loading and temperature variations through long-term operation are investigated. The investigation includes stack designs with and without contact components combined with machined (cross-shaped) or pressed (corrugated) interconnects. Two different generic temperature profiles in the sta..