The effect of copper deficiency on the baking quality and dough properties of wheat flour

Abstract

Wheat was sown at a site known to be deficient in soil copper to investigate the effect of copper deficiency on the physical dough and baking properties of flour. Copper was applied as a foliar spray at late tillering and/or booting stages of plant growth. Plants on plots that were not treated were stunted, had delayed maturity and had malformed heads; all classic signs of copper deficiency. The application of copper resulted in an increase in grain yield with the grain being well filled and with no visual evidence of copper deficiency. There was also a slight improvement in the dough and baking quality; however, this was not as great as when a second application of copper was made at the bo..