Journal article

Boron nitride@graphene oxide hybrids for epoxy composites with enhanced thermal conductivity

T Huang, X Zeng, Y Yao, R Sun, F Meng, J Xu, C Wong

RSC Advances | Published : 2016

Abstract

Polymer-based materials have widely been used for electronics packaging owing to their excellent physical and chemical properties. However, polymer materials usually have low thermal conductivity, which thus may impair the performance and reliability of modern electronics. In this paper, we report an epoxy-based composite with increased thermal conductivity by using graphene oxide-encapsulated boron nitride (h-BN@GO) hybrids as fillers. The thermal conductivity of the obtained composites increased with the loading of h-BN@GO hybrids to a maximum of 2.23 W m-1 K-1 when the loading of h-BN@GO hybrids was 40 wt%, which is double that of composites filled with h-BN. This increase is attributed t..

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University of Melbourne Researchers

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