Dielectric substrate self-bias and plasma confinement in two-dimensional scanning radio frequency plasma-enhanced chemical vapour deposition

Abstract

A two-dimensional scanning radio frequency (RF) plasma method was developed for large area deposition in order to avoid difficulties encountered in conventional large RF plasma systems, offering precision control of plasma, improved uniformity of thickness and microstructure, and simplicity of system design. Guarded electrode houses were introduced to form localized plasma thus parasitic plasma or parasitic deposition outside the localized plasma region was eliminated. Different electrode configurations were studied and optimized. Self-bias on dielectric substrate was studied for different electrode configurations as a function of RF power, pressure, and gases. Eliminating parasitic plasma b..