Flip-Chip Interconnection Effects on 60-GHz Microstrip Antenna Performance
G Felic, S Skafidas
IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | Published : 2009
In this letter, we investigate the effects of flip-chip interconnection on microstrip antenna performance. In particular, we explore the relationship of the flip-chip interconnection parameters to the bandwidth, radiation efficiency, and gain. It is shown that microstrip antenna bandwidths of 15% can be achieved with careful flip-chip interconnection design and fabrication. This study is of particular importance at 60 GHz for the integration of millimeter-wave antennas into the package. © 2009 IEEE.
This work was performed at NICTA, Victorian Research Laboratory. NICTA is funded by the Australian Government as represented by the Department of Broadband, Communications and the Digital Economy and the Australian Research Council through the ICT Centre of Excellence Program.